placementmodulecoursedescription英文版(專業版)

　　

【正文】 Nozzle hit167。 B – Mechanical Chuck D – OvalA – Solder PasteB – Mechanical Chuck CH0 Slide53Placement Module Training Intel Confidential ( for internal usage only) REVIEW SUMMARY? CTFP is a measurement used to determine whether the placement module parameter will provide quality assembly output.l For placement module, here are several parameter is to ensure ponent placement quality assembly output.? Part Data? Vision Type? Feeder Type? Nozzle Type? Nozzle Bend Limit? Board Support Type? Firmware/Software Revision? Air Supply/Vacuum Pressure? Machine ZHeight CH0 SlidePlacement Module Training Intel Confidential ( for internal usage only) Placement Module Response Flow Check list Common Failure modes Chapter 5 CH0 Slide55Placement Module Training Intel Confidential ( for internal usage only) Placement Module Response Flow Check list Common Failure modes Course Description OBJECTIVES: Upon pletion of this topic, the participant will be able to do the following:? Identify mon failure modes for placement module ? Describe how to solve placement issuesIntel Malaysia Technical Training website CH0 Slide56Placement Module Training Intel Confidential ( for internal usage only) No. Common Failure ModesRoot Cause Possible Solution1 Missing part Incorrect nozzle used, nozzle damaged, incorrect part picked up, wrong feeder used, incorrect Part Data usedUse correct nozzle, replace with new nozzle, load in correct part, use correct feeder, use correct Part Data2 Shift/skew Incorrect nozzle used, nozzle bend, machine accuracy is out, incorrect part picked up, wrong feeder used, incorrect Part Data usedUse correct nozzle, replace with new nozzle, recalibrate machine, replace with correct part, use correct feeder, use correct Part Data3 Misorientated Incorrect part placement angle, incorrect ining part orientationPlace part per orientation specified, replace ining part with correct part orientation4 Tombstone Part placement offset Improve placement accuracy5 Wrong part Wrong part loaded Load in correct part6 Damaged part Nozzle hit, defective ining materialChange Part Data to correct setting7 High attrition lossWrong nozzle used, nozzle damaged, wrong part picked upUse correct nozzle, replace nozzle, replace with correct partPlacement Common Failure Modes CH0 Slide57Placement Module Training Intel Confidential ( for internal usage only) Wrong ComponentDamaged Component Missing ComponentBent Lead Lifted Lead Shift/Skew TombstonePlacement Common Failure Modes Pictures CH0 Slide58Placement Module Training Intel Confidential ( for internal usage only) l Missing Part167。 Chipset – 5612 feederl Nozzle Type167。 To ensure nozzle is in good condition for part pickup placement meeting the spec. Generally, nozzle bend limit is set CH0 Slide44Placement Module Training Intel Confidential ( for internal usage only) Which one below is not an item used under PCS for placement module? 1: Component Check 2: Backlight Vision System3: Attrition Loss2: Backlight Vision System CH0 Slide45Placement Module Training Intel Confidential ( for internal usage only) Chapter 3 Quiz1) What is the real time system that is use to identify respond to process or equipment problemsA – RFC C SPCB – PCS D – AOI2) Which below is not the mon measurement or variable for placement module A – Feeder Check C – Attrition loss B – Program Check D – Overhead gantrystyle3) _____ is used to collects machine attrition loss while the placement module is running.167。 Vision systeml Different types of placement modules available are Fuji CP6, IP3, Universal, Phillips and etc.l Key challenges are on smaller, fine pitch odd shape part placementEnd of Chapter 1 CH0 Slide25Placement Module Training Intel Confidential ( for internal usage only) Appendix 1: NonGrid Array Placement Equipment CapabilityEquipment Supplier Model Software / Firmware Version Ball Recognition Capable % Ball Presence Inspection Correct Polarity DetectionCommentsFuji NP251 N/A YES 100% YES Fuji has provided the PD files to Intel for dist. to our QP341/351 N/A YES 100% YESFuji QP242 Cam 7 YES 100% YESFuji QP242 Cam 4 YES 50% YES Inadequate lighting.Fuji IPIII 4800/cam12 YES 100% YES MCS not capable. Need F4G or IPIII 4400/cam13 YES 100% YESPanasonic MSF N/A Partial 10% YES Current equipment can only inspect the perimeter array. Panasonic will develop 100% ball inspection for MSF MPAV2 machines for a charge – 1 month lead time.Panasonic CM402 N/A Partial 10% YESPanasonic MPAV2A/B N/A Partial 10% NOPanasonic MPAV2 N/A Partial 10% NOPanasonic MPAV N/A Partial 10% NOUniversal GSM1 N/A Partial 10% NO Center array only unless purchase UPS+ software hardware GSM2 N/A Partial 10% NOSiemens F4/F5 N/A YES 100% YESGF File avail. 32mm FOV 4 images / 2 sec per part CH0 SlidePlacement Module Training Intel Confidential ( for internal usage only) Placement Process Spec OverviewChapter 2 CH0 Slide27Placement Module Training Intel Confidential ( for internal usage only) Placement Process Spec Course Description OBJECTIVES: Upon pletion of this topic, the participant will be able to do the following:? Find the appropriate spec for the placement module.? Navigate through the spec and use it as a reference document.? Educate how to understand Intel process and applied the knowledge when dealing with customers.Intel Malaysia Technical Training website CH0 Slide28Placement Module Training Intel Confidential ( for internal usage only) l The purpose of spec is to provide guidelines on handling equipment to ensure consistent practices among different usersl Each respective SMT module will have its own specsl A typical module will have