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【正文】 Technology for Competitive Electronics Manufacturing, .: McGrawHill, Inc.[11] Siamak Anvari and Mai Chow (1991), Optimization of Thermal Profiles with Forced Convection Reflow, Mount International Conference amp。 Exposition, Proceedings of the Technical Program, .[12] Charles L. Hutchins (1995), Troubleshooting the SMT/FPT Process, .: C. Hutchins and Associates.[13] Ted Lancaster (1991), The Characterization of Automated Printing Machines, International Conference amp。 Exposition, Proceedings of the Technical Program, 239.[14] Ralph W. Woodgate (1993), A guide to defectfree soldering, .: Miller Freeman Books.[15] Charles L. Hutchins (1995), Understanding and Using Surface Mount and Fine Pitch Technology, .: C. Hutchins amp。 Associates.[16] David M. Shaddock (1991), Process Characterization of A Fine Pitch Process, International Conference amp。 Exposition, Proceedings of the Technical Program, 252.19 / 23[17] . Chung and K. Srihari (1994), Closed Loop Process Control for Solder paste Stencil Printing, Surface Mount International Conference amp。 Exposition Proceedings of the Technical Program, .[18] Lefteri H. Tsoukalas and Robert E. Uhrig (1997), Fuzzy and Neural Approaches in Engineering, .: John Wiley amp。 Sons, Inc.[19] Moti Schneider, Abraham Kandel, Gideon Langholz, and Gerard Chew (1996), Fuzzy Expert system Tools, .: John Wiley amp。 Sons.[20] Bart, Kosko. (1992), Neural Networks and Fuzzy Systems, Englewood Cliffs, .: Prentice Hall.玖、附錄圖. A Volume Decision surface (Pressure vs. Pad Dim.)圖. B Volume Decision surface (Pressure vs. snapoff height)20 / 23圖. C Volume Decision surface (Pad Dim. vs. Squeegee speed)圖. D Resolution Decision surface (Pressure vs. snapoff height)圖. E Resolution Decision surface (Pressure vs. snapoff height)圖. F Resolution Decision surface (Pressure vs. paste viscosity)圖. G Preheating slope decision surface (1st vs. 2nd temperature setting)圖. H Preheating slope decision surface (1st vs. 3rd temperature setting)21 / 23圖. I Soaking temperature decision surface (2nd vs. 3rd temperature setting)圖. J Soaking temperature decision surface (3rd vs. 4th temperature setting)圖. K Peak temperature decision surface (4 th vs. 3rd temperature setting)圖. L Peak temperature decision surface (4th vs. PCBA density temperature setting)Printing step Prediction0102030405060701234567891011213141516171819202122324252627282930Dat SetValues Pri_resoPri_reso predictPri_shiftPri_shift predictVolumeVolume predict圖. M 錫膏印刷仿真誤差曲線圖Bar Chart Printing Resolution Prediction Bias01234567891015 5 0 5 20 10 20 25 10 15 25其 他Frequency.00%%%%%%%%%%%FrequencyAcc. %圖. N 錫膏印刷仿真 – 印刷效果誤差長條圖22 / 23Bar Chart Prnting Shift Rate Prediction Bias024681012141618200 10 5 5 15 20 10 15 20 其 他BinFrequency.00%%%%%%%%%%%FrequencyAcc. %圖. O 錫膏印刷仿真 – 印刷偏移誤差長條圖Bar Chart Deposited Volume Prediction Bias01234567890 1 2 1 2Frequency.00%%%%%%%%%%%FrequencyAcc. %圖. P 錫膏印刷仿真 – 印刷錫膏量誤差長條圖Bar Chart for Reflowing Step Prediction0501001502002501 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37Data setValuesSoakingSoaking Predictpeakpak predict圖. Q 回焊制程仿真誤差曲線圖Bar Chart Preheating Prediction Bias01234567890 1 1OthersFrequency.00%%%%%%%%%%%FrequencyAcc. %圖. R 回焊制程仿真 – 預熱斜率誤差長條圖Bar Chart Soaking Temp. Prediction Bias0246810122 0 4 2 6 6 4 10 8 8 10 12 14 其他Frequency.00%%%%%%%%%%%FrequencyAcc. %圖. S 回焊制程仿真 – 浸潤溫度誤差長條圖Bar Chart Peak Temp. Prediction Bias02468101214165 0 5 15 10 20 10 15 20 25OthersFrequency.00%%%%%%%%%%%FrequencyAcc.%圖. T 回焊制程仿真 – 尖峰溫度誤差長條圖23 / 23** End of Thesis *