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自動(dòng)化專業(yè)畢業(yè)設(shè)計(jì)外文翻譯--基于嵌入式處理器的vlsi芯片的溫度自動(dòng)控制-資料下載頁

2026-05-02 18:42本頁面

【導(dǎo)讀】1．外文文獻(xiàn)翻譯的內(nèi)容應(yīng)與畢業(yè)設(shè)計(jì)/論文課題相關(guān)。成不少于2020漢字的二外文獻(xiàn)翻譯任務(wù)。學(xué)武昌分校本科畢業(yè)設(shè)計(jì)/論文撰寫規(guī)范》的要求撰寫。本附件為封面，封面上不得出現(xiàn)頁碼。器LM35和ARM處理器LPC2378來完成設(shè)計(jì)。在目前的工作中，將傳感器放置在非常接近接近到IC集成電路的位。在硬件電路中也提供了一個(gè)蜂鳴器，在無法控制風(fēng)扇或者IC集成電路的過熱。的情況下都會(huì)發(fā)出警報(bào)。并可能持續(xù)上升。作頻率和影響時(shí)序的規(guī)范。因此，在允許的條件范圍內(nèi)，為了讓高速芯片能得到最。LM35不需要校準(zhǔn)或微調(diào)，便可以提供提供在室溫±℃精。電流供應(yīng)，所以它自身產(chǎn)生的熱量較低，在真空中約升溫℃。變化與LM35溫度傳感器的電壓輸出同步。相連，來顯示該集成電路的溫度和風(fēng)扇轉(zhuǎn)速。基于嵌入式ARM處理器的溫度控制系統(tǒng)的設(shè)計(jì)和實(shí)施已經(jīng)完成了。并發(fā)現(xiàn)溫度重返正常溫度。算機(jī)的位置，慢慢的我們觀察到風(fēng)扇的速度自動(dòng)增加，芯片的溫度被控制。

　　

【正文】 d chip, but can be significantly lower and the difference between measured temperature and the actual die temperature increases as the power dissipation increases. So, the temperature of the circuit board or heat sink must be correlated to the die temperature of the high speed chip. Of course a better alternative is possible with a number of high speed chips. Many CPUs, FPGAs and other high speed ICs include a thermal diode which is actually a diode connected bipolar transistor, on the die. Using a remote diode temperature sensor connected to this thermal diode, the temperature of the high speed IC’s die can be measured directly with an excellent accuracy. This not only eliminates the large temperature gradients involved in measuring temperature outside the target IC’s package, but it also eliminates the long thermal time constants,from several seconds to minutes, that cause delays in responding to die temperature changes. 12 There is also a drawback in fan speed control. Normally the fan speed is controlled by adjusting the power supply voltage of the fan. This is done by a lowfrequency PWM signal, usually in the range of about 50 Hz, whose duty cycle is varied to adjust the fan’s speed. This is inexpensive and also efficient. But the disadvantage of this method is that it makes the fan somewhat nosier because of the pulsed nature of the power supply. The PWM waveforms fast edges cause the fans mechanical structure to move, which is easily audible. In some systems, it is also important to limit the rate of change of the fan speed. This is critical when the system is in close proximity to users. Simply switching a fan on and off or changing speed immediately as temperature changes is acceptable in some environments. But when users are in nearby, the sudden changes in fans noise are highly annoying. So to avoid these effects the fan’s drive signal must be limited to an acceptable level. 5. Future Scope of the Work In the present work temperature is sensed using the temperature sensor LM35 and the speed of the motor is controlled by varying the width of PWM generated by the processor. But the temperature sensed by the IC LM35 is not very accurate even though we keep the IC very near to the processor orVLSI chip. So, we can use a remote diode temperature sensor connected to the thermal diode which measures the temperature of the high speed ICs directly with excellent accuracy. Another important aspect is a variety of remote temperature sensors with up to five sensing channels is available that can detect the die temperature of the high speed chip and transmit temperature data to a speed regulators with multiple channels of fan tachometer monitoring can provide reliable control of fan RPM or supply voltage based on mands from an external microcontroller. For this simple ICs are provided by MAXIM MAX6660 and MAX6653. The first IC can sense the remote temperature and controls the fan speed based on that temperature. It 13 produces a DC supply voltage for the fan through an internal power transistor. The second IC also performs a similar function but drives the fan with a PWM waveform through an external pass transistor. Both include plete thermal fault monitoring with over temperature outputs, which can be used to shut down the system if the high speed chips get too hot. So, the present work can be improved further by using the above mentioned techniques.

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